2018 International Conference On Computer Aided Design

The Premier Conference Devoted to Technical Innovations in Electronic Design Automation

November 5-9, 2018Hilton San Diego Resort & Spa San Diego, CA

Tue, 2017-08-29 15:54 -- root
Multiple factors can cause circuits and memories to fail --- aging, stress, defects and layout imperfectness all play a role. This session aims to alleviate these reliability and yield challenges. The first paper presents a procedure for evaluating the performance of 3D-stacked wide-I/O DRAMs under process-induced stress. The second paper combines multiple ideas to implement a dynamic partitioning scheme in dense memories that can better address clustered stuck-at faults. The third paper presents a fast algorithm for electromigration-induced IR-drop degradation in an on-chip power grid. The last paper introduces multi-row detailed placement that mitigates neighbor diffusion effect for yield improvement.
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Regular Session
Salons A & B1
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Wednesday, November 15, 2017 -
13:45 to 15:45
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