2017 International Conference On Computer Aided Design

The Premier Conference Devoted to Technical Innovations in Electronic Design Automation

November 13-16, 2017Irvine Marriott Irvine, CA

Tue, 2017-08-29 15:54 -- root
Multiple factors can cause circuits and memories to fail --- aging, stress, defects and layout imperfectness all play a role. This session aims to alleviate these reliability and yield challenges. The first paper presents a procedure for evaluating the performance of 3D-stacked wide-I/O DRAMs under process-induced stress. The second paper combines multiple ideas to implement a dynamic partitioning scheme in dense memories that can better address clustered stuck-at faults. The third paper presents a fast algorithm for electromigration-induced IR-drop degradation in an on-chip power grid. The last paper introduces multi-row detailed placement that mitigates neighbor diffusion effect for yield improvement.
Event ID: 
0ab82488-69d2-4357-820e-ad1dc82d247c
Event Type: 
Regular Session
Location: 
Salons A & B1
Event Time: 
Wednesday, November 15, 2017 -
13:45 to 15:45
Session Number: 
9
Session Number Suffix: 
A
Session Number: 
9
confID: 
242